Tronly New Electronic Materials & Hangzhou City Investment Capital conducting in

On January 9, 2022, Qian Xiaochun, Chairman of the Board of Directors of Changzhou Tronly New Electronic Materials, Gao Xiang, Chairman of Hangzhou City Investment Capital, Qian Bin, Assistant Chairman of Tronly New Electronic Materials, Wu Tianyu, Deputy General Manager of Business Division of Tronly New Electronic Materials, visited Zhuhai Dynamic Technology to carry out investigation and survey.

Mrs. Qiu Hongbin, Chairman of the Board, warmly welcomed Chairman Qian and Chairman Gao, and visited the newly completed technology exhibition hall of Dynamic Technology together to learn about the company's history, brand evolution, development plan and manufacturing situation. Later, Chairman Qian and Chairman Gao visited the R&D technical laboratory of the company, inspected the product system and R&D plan of the company in detail, affirmed the expectation that the R&D laboratory of Dynamic Technology could be built into a key engineering application center of Guangdong Province, and put forward some constructive suggestions.

At the research forum, Chairman Qiu expressed her gratitude for Tronly's support to Dynamic Technology over the years and Hangzhou City Investment Capital's attention to the company. She looked forward to the complementary advantages of the three parties, and the deep integration of industry & finance, to achieve common development and jointly create the most competitive industrial chain in the industry. Chairman Qian and Chairman Gao congratulated Dynamic Technology on the leapfrog development achieved in 2021, and thanked Chairman Qiu for his trust over the years. Meanwhile, they hoped that all parties could give full play to their respective advantages in line with the principle of common development, and on the basis of consolidating the optimization and stability of the existing core formula in PCB, FPC and other circuit interconnection fields, jointly promote important breakthroughs in key materials and process level in panel display and semiconductor advanced packaging fields such as solder resist, substrate/substrate-like PCB and thick photoresist, strive for integrated supply chain solutions, strengthen all-round and in-depth cooperation, and seek a higher level of win-win development of photoresist industrial chain and service chain.